Soldering robot

REECO Soldering Robot is designed for medium volume THT production.

  • parameters

    • Diameter of the handled binder
      0,8 mm | 1,0 mm | 1,2 mm
    • Width of supported applications
      350 mm
    • Length of supported applications
      420 mm
  • housing variants

  • technical specification

    • Automatic workpiece positioning (mechnical or vision system)
    • Process parameters controlled by the PLC
    • Tin feeder with optional feeding profile configuration
    • More than 40 different types of mechanical tip cleaner
    • Induction power available for a tip - 150 W
    • Tip mechanical cleaner
    • Inline transport of the soldered part
    • Modular design of the unit
    • Possibility to control the soldering profile for each point
    • Possibility to work in an automatic line with other devices
    • Nitrogen shielding capability
  • options

    • Vision system for workpiece positioning
    • Vision system for inspection after soldering process
    • Statistical data available via OPC UA protocol
    • Possibility of introducing product traceability
    • Possibility of replacing the soldering head with ones of other functionalities
  • construction dimensions

Soldering robot

REECO Soldering Robot is designed for medium volume THT production.

  • parameters

    • Diameter of the handled binder
      0,8 mm | 1,0 mm | 1,2 mm
    • Width of supported applications
      350 mm
    • Length of supported applications
      420 mm
  • housing variants

  • technical specification

    • Automatic workpiece positioning (mechnical or vision system)
    • Process parameters controlled by the PLC
    • Tin feeder with optional feeding profile configuration
    • More than 40 different types of mechanical tip cleaner
    • Induction power available for a tip - 150 W
    • Tip mechanical cleaner
    • Inline transport of the soldered part
    • Modular design of the unit
    • Possibility to control the soldering profile for each point
    • Possibility to work in an automatic line with other devices
    • Nitrogen shielding capability
  • options

    • Vision system for workpiece positioning
    • Vision system for inspection after soldering process
    • Statistical data available via OPC UA protocol
    • Possibility of introducing product traceability
    • Possibility of replacing the soldering head with ones of other functionalities
  • construction dimensions

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